Electroless gold plating solution for micro bump formation "Aurexel MD"
Achieving the formation of microbumps with excellent in-plane uniformity through non-electrolytic gold plating!
"Aurexel MD" is a high-speed electroless gold plating solution suitable for forming microbumps on the order of a few micrometers. 【Features】 ■ Enables the formation of microbumps just a few micrometers in size using a high-speed reductive Au plating solution. ■ Cyanide-free, enabling processing under neutral conditions at low temperatures. ■ Excellent in-plane uniformity, capable of plating on independent patterns and batch processing.
- Company：KANTO CHEMICAL CO., INC. Electronics Material Division
- Price：Other
